ABF & TGV Substrate
ABF Substrate
- Body Size Max. 110 x 110mm
- Stackup Max.10+N+10
- Bulidup Layer Via/Pad Size (um) Min.50/75
- Bulidup Layer Line/Space (um) Min.8/8
- Bump Ptich (um) Min.90
TGV Substrate
- Build up 3+2+3- 7+2+7 for low volume production
- Sample build for8+2+8 and above in Xiamen
- TGV diameter 100um and below
Substrate
Full Spectrum IC Substrate support for all package solutions, including FCBGA, FCCSP, CSP, SiP
- 2-14L Anylayer with core / coreless structure
- Line/Spaces：
・Subtractive:20/35um volume
・mSAP:25/25um volume, 15/15um sample
・ETS:20/20um volume, 15/15um sample
・SAP:12/12um volume, 9/12um sample - 130um Pitch Flip-Chip CSP/BGA
- Sub-0.2mm 6L Core/Coreless substrates
- BT/FR5/ABF Ultra low CTE, Low loss materials
- 2.5D cavity, Embedded pattern (ETS:Embedded Trace Substrates), Distributive buried capacitance and buried resistance layer
- Solder-on-Pad (SOP Technology within print and microball）
Advanced HDI PCBs
High volume, reliable advanced HDI products
with up to 16 layer any layer
40/40um L/S
Fine pitch BGA
Up to 77G Hz High speed material hybrid HDI
Heavy Cu, Coin and novel thermal solutions
Substrate-Like-PCB
High Volume, Competitive pricingsubstrate-like-PCB (SLP) products
- 6-14L Anylayer structure
- modified Semi-Additive (mSAP) technology
- 30/30um L/S volume, 25/25um L/S Sample
- 0.3mm Pitch SoC design with massive I/Os
- Next generation mainboard solutions for fine pitch, large I/O counts packages on mobile devices
- Cavity and 2.5D structures
SLP (Substrate-like-PCB) PCBs
High volume, reliable substrate-like-PCB
(SLP) products with Modified Semi-Additive (mSAP) technology
30/30um L/S
Fine pitch Fan-out Wafer
Level Package with large I/OS
Advanced & Anylayer HDI
High Volume, Highly Reliable advanced and anylayer HDI rigid PCBs
- Up to 18L Anylayer HDI
- 40/40um L/S
- 0.3mm fine-pitch BGA
- Up to 77GHz high speed material hybrid HDI
- Distributive embedded capacitors and resistors
- Cavity and 2.5D structures
- Heavy copper, coin and novel thermal solutions
IC Substrates
Ultra thin, highly customized module substrates
20/40um Subtractive, 20/30um mSAP L/S
150um Pitch Flip-chip CSP
<0.2mm 6L Core/Coreless substrate
BT/FR5 Ultra low CTE, Low loss, LED module Application Material
2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
Solder-on-Pad (SOP Technology)
Rigid-Flex & Flex
High Volume, Low loss options Rigid-Flex & Flex
- Conventional PTH and Advanced / Anylayer HDI for Flex/Rigid-Flex PCBs w up to 8 flex layers
- 40/40um L/S
- Fine-pitch devices
- 12um PI, 10um coverlay ultra thin rigid-flex
- PI and low loss mPI / LCP materials
- Flex-to-Install / Dynamic bend / Semi-Flex^
- Symmetrical / Asymmetrical structures
^Bending FR4 Flex
SMT & Assembly
Automatic Assembly Lines for TSOP / QFP / QFN / LGA / BGA
- Equipment: 39 SMT lines / 48 Printers / 77 Mounters / 25 AOIs
- Max. board size: 460 x 400mm
- Component: 01005
- SMT capabilities: TSOP / QFP / QFN / LGA / BGA
- Customized assembly and testing
New Energy Module
New Energy Battery CCS / CTP Module
- Large panel size up to 1.8m（ bending could be 2.5m） for temperature and voltage sensing and overcurrent protection
- Puncture crimp connector, Al/Cu ultrasonic welding
- Hot press CCS, PET insulation film, Hot riveting & injection molding
- One stop-shop for design, layout, simulation, fabrication, SMT, testing and assembly
Flex / Flex-assembly / Rigid Flexible (HDI) PCBs
Flex, Flex-assembly, Rigid-flex
with advanced HDI / any layer technology
40/40um L/S
Fine pitch devices
12um PI, 10um Coverlay ultra thin thickness
Dynamic bend / Install bend / Semi-Flex
Symetrical/Unsymmetrical structures
PI and low loss PI/LCP materials
Customized assembly and testing
