AKM Meadville Plans RMB 6.5bn Investment in Packaging Substrate Project
8 September 2021 – Today, AKM Meadville Electronics (Xiamen) Co. Ltd. (AKMMV) and Haicang district government were officially signed a joint-venture contract, with a total investment of RMB 6.5bn, at a contract signing ceremony of “21st China International Fair for Investment Trade” in Xiamen to develop the packaging substrate project, comprising R&D, production and sales. The project will divide into two phases and the annual output value except to reach RMB 12bn.
At the signing ceremony, Mr. Kong Ling-wen, Deputy Board Chairman of AKMMV, said, “Through emerging modern industries strategically, Haicang district will gain the competitive advantages in the future. And we firmly believe that it will be one of the fastest-growing districts in China. This packaging substrate project offers a great opportunity for Haicang district to strengthen the development of IC Packaging industry.” As a frontier market position in China, AKMMV is willing to work together with the local government to promote rapid industry growth and contribute to the future development of Haicang district.”
In addition to AKMMV Packaging Substrate Project, other key investment projects were also signed on the same day, covering a broad spectrum of fields like bio-medical, new energy, and modern logistics, with a total investment of over RBM 30bn. Mr. Kong witnessed the signing ceremony, officials from related governmental departments of Fujian province, Xiamen city, as well as Haicang district and the press.
