Advanced HDI PCBs
High volume, reliable advanced HDI products
- with up to 16 layer any layer
- 40/40um L/S
- Fine pitch BGA
- Up to 77G Hz High speed material hybrid HDI
- Heavy Cu, Coin and novel thermal solutions
Advanced HDI PCBs
High volume, reliable advanced HDI products
with up to 16 layer any layer
40/40um L/S
Fine pitch BGA
Up to 77G Hz High speed material hybrid HDI
Heavy Cu, Coin and novel thermal solutions
SLP (Substrate-like-PCB) PCBs
High volume, reliable Substrate-like-PCB (SLP) products
- with Modified Semi-additive (mSAP) technology
- 30/30um L/S
- Fine pitch Fan-out Wafer
- Level Package with large I/OS
SLP (Substrate-like-PCB) PCBs
High volume, reliable substrate-like-PCB
(SLP) products with Modified Semi-Additive (mSAP) technology
30/30um L/S
Fine pitch Fan-out Wafer
Level Package with large I/OS
IC Substrates
Ultra thin, highly customized module substrates
- 20/40um Subtractive, 20/30um mSAP L/S
- 150um Pitch Flip-chip CSP
- <0.2mm 6L Core/Coreless substrate
- BT/FR5 Ultra low CTE, Low loss, LED module Application Material
- 2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
- Solder-on-Pad (SOP Technology)
IC Substrates
Ultra thin, highly customized module substrates
20/40um Subtractive, 20/30um mSAP L/S
150um Pitch Flip-chip CSP
<0.2mm 6L Core/Coreless substrate
BT/FR5 Ultra low CTE, Low loss, LED module Application Material
2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
Solder-on-Pad (SOP Technology)
Flex / Flex-assembly /Rigid Flexible (HDI) PCBs
Flex, Flex-assembly, Rigid-flex
- with advanced HDI / any layer technology
- 40/40um L/S
- Fine pitch devices
- 12um PI, 10um Coverlay ultra thin thickness
- Dynamic bend / Install bend / Semi-Flex
- Symetrical/Unsymmetrical structures
- PI and low loss PI/LCP materials
- Customized assembly and testing
Flex / Flex-assembly / Rigid Flexible (HDI) PCBs
Flex, Flex-assembly, Rigid-flex
with advanced HDI / any layer technology
40/40um L/S
Fine pitch devices
12um PI, 10um Coverlay ultra thin thickness
Dynamic bend / Install bend / Semi-Flex
Symetrical/Unsymmetrical structures
PI and low loss PI/LCP materials
Customized assembly and testing
